Description
With its unique high-density filling of micronized silver and enhanced thermally conductive ceramic particles, Arctic Silver 5 provides a new level of performance and stability. Available at Arctic Silver resellers worldwide. Arctic Silver 5 is the reference premium thermal compound. Arctic Silver 5 is optimized for a wide range of bond lines between modern high-power CPUs and high performance heatsinks or water-cooling solutions.
Made With 99.9% Pure Silver
Arctic Silver 5 uses three unique shapes and sizes of pure silver particles to maximize particle-to-particle contact area and thermal transfer.
High-Density
Arctic Silver 5 contains over 88% thermally conductive filler by weight. In addition to micronized silver, Arctic Silver 5 also contains sub-micron zinc oxide, aluminum oxide and boron nitride particles. These thermally-enhanced ceramic particles improve the compound's performance and long-term stability
SPECIFICATIONS:
Average Particle Size |
<0.49 micron <0.000020 inch |
Extended Temperature Limits |
Peak: –50°C to >180°C Long-Term: –50°C to 130°C |
Performance |
3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core. |
Coverage Area |
15 to 25 small CPU cores, or 6 to 10 large CPU cores, or 2 to 5 heat plates |