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SPECIFICATIONS:
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Weight
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Main Board : 57g / 2.01 oz, Half-Height Bracket : 12g / 0.42 oz
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Dimensions
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Main Board: 117.4 x 121 x 21.6 mm / 4.62 x 4.76 x 0.85 inches, Half-Height Bracket: 80 x 21.6 mm / 3.15 x 0.85 inches
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Audio Technology
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SmartComms Kit
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Signal-to-Noise Ratio (SNR)
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120 dB (DAC)
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Direct Mode
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Headphone (Stereo): PCM 16-bit, 44.1, 48.0, 88.2, 96.0. 192.0 kHz
Headphone (Stereo): PCM 24-bit, 44.1, 48.0, 88.2, 96.0. 192.0 kHz
Line Out (Stereo / Surround): PCM 16-bit, 44.1, 48.0, 88.2, 96.0. 192.0 kHz
Line Out (Stereo / Surround): PCM 24-bit, 44.1, 48.0, 88.2, 96.0. 192.0 kHz
Optical Out (Stereo)*: PCM 16-bit, 44.1, 48.0, 88.2, 96.0, 192.0 kHz
PCM 24-bit, 44.1, 48.0, 88.2, 96.0, 192.0 kHz
* Optical Out is available with DBPro daughter board upgrade
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DSD Playback
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Headphone/Line Out (Stereo): Native DSD: DSD64, DSD128, DSD256
DoP: DSD64
^ DSD Playback is available with DBPro daughter board upgrade
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Recording Resolution
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Mic-in (Mono): Mono, 16-bit, 44.1, 48.0, 88.2, 96.0 kHz
Mic-in (Mono): Mono, 24-bit, 44.1, 48.0, 88.2, 96.0 kHz
Line-in (Stereo): Stereo, 16-bit, 44.1, 48.0, 88.2, 96.0, 192.0 kHz
Line-in (Stereo): Stereo, 24-bit, 44.1, 48.0, 88.2, 96.0, 192.0 kHz
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Connectivity Options (Main)
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1 x ⅛″ Mic-in, 1 x ⅛″ Line-in, 1 x ⅛″ Headphone / Headset-out / Front-out (default as Headphone / Headset), 1 x ⅛″ Rear-out, 1 x ⅛″ Centre / Sub-out
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Headphone Amp
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Supported Headphone Impedance: 32–600Ω, Output Impedance: 10Ω
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Max Channel Output
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5.1 Channels
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Supported Operating Systems
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Windows® 10, Windows® 11
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ASIO
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ASIO 2.3
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DAC
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THD+N: ≤0.004%
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Recommended Usage
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Home Entertainment
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System Requirements
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Windows® OS
Intel® Core™i3 or AMD® equivalent processor
Intel, AMD, or 100% compatible motherboard
Microsoft® Windows 10 32 / 64-bit or higher
>4 GB RAM
>4 GB of free hard disk space
Available PCIe slot
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Package Contents
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Sound Blaster Audigy Fx V2 Sound Card
Half-height bracket (Full height bracket mounted on board)
Quick Start Leaflet
Warranty Leaflets
SmartComms Kit Leaflet
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